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 Freescale Semiconductor
Advance Information
Document Number: MPC7410ECS02AD Rev. 2.0, 11/2007
--- Preliminary --MPC7410 RISC Microprocessor Hardware Specifications Addendum for the MPC7410xxnnnNE Series
This document describes part number-specific changes to recommended operating conditions and revised electrical specifications, as applicable, from those described in the general MPC7410 Hardware Specifications (Document No. MPC7410EC). Specifications provided in this document supersede those in the MPC7410 Hardware Specifications, for the part numbers listed in Table A only. Specifications not addressed herein are unchanged. Because this document is frequently updated, refer to http://www.freescale.com or to your Freescale sales office for the latest version. Note that headings and table numbers in this document are not consecutively numbered. They are intended to correspond to the heading or table affected in the general hardware specification. Part numbers addressed in this document are listed in Table A. For more detailed ordering information see Table 17.
Freescale Part Numbers Affected: MPC7410RX400NE MPC7410HX400NE MPC7410VS400NE MC7410VU400NE MPC7410RX450NE MPC7410HX450NE MPC7410VS450NE MC7410VU450NE
This document contains information on a new product. Specifications and information herein are subject to change without notice.
(c) Freescale Semiconductor, Inc., 2002, 2007. All rights reserved.
Features
Table A. Part Numbers Addressed by this Data Sheet
Operating Conditions Freescale Part Number CPU Frequency 400 MHz Vdd 1.5V50mV TJ (C) 0 to 105 OVdd 1.8/2.5 V Significant Differences from Hardware Specification
MPC7410RX400NE MPC7410HX400NE MPC7410VS400NE MC7410VU400NE
Reduced core voltage to achieve lower power consumption. Removes 3.3V OVdd support. For all AC/DC specifications not mentioned in this document, please refer to the MPC7410(RX/HX/VS)400LE and MC7410VU400LE specifications in the general MPC7410 Hardware Specifications.
450 MHz
1.8V 100mV
0 to 105
1.8/2.5/3.3 V The MPC7410(RX/HX/VS)400NE and MC7410VU400NE also fully conform to the MPC7410(RX/HX/VS)450LE and MC7410VU450LE specifications, respectively. Refer to the general MPC7410 Hardware Specifications. 1.8/2.5 V Reduced core voltage to achieve lower power consumption. Removes 3.3V OVdd support. For all AC/DC specifications not mentioned in this document, please refer to the MPC7410(RX/HX/VS)450LE and MC7410VU450LE specifications in the general MPC7410 Hardware Specifications.
MPC7410RX450NE MPC7410HX450NE MPC7410VS450NE MC7410VU450NE
450 MHz
1.5V50mV
0 to 105
500 MHz
1.8V 100mV
0 to 105
1.8/2.5/3.3 V The MPC7410(RX/HX/VS)450NE and MC7410VU400NE also fully conform to the MPC7410(RX/HX/VS)500LE and MC7410VU500LE specifications, respectively. Refer to the general MPC7410 Hardware Specifications.
2 Features
This section summarizes changes to the features of the MPC7410 described in the MPC7410 Hardware Specifications. * Bus interface -- Selectable interface voltages of 1.8 V, 2.5 V (3.3 V not supported)
4.1 DC Electrical Characteristics
Voltage to the L2 I/Os and processor interface I/Os are provided through separate sets of supply pins and may be provided at the voltages shown in Table 2.
MPC7410 RISC Microprocessor Hardware Specifications Addendum for the MPC7410xxnnnNE Series, Rev. 2.0 2 Freescale Semiconductor
Features
Table 2. Input Threshold Voltage Setting
BVSEL Signal 3 0 HRESET 1 HRESET Processor Bus Input Threshold is Relative to: 1.8 V 2.5 V Not Supported Not Supported L2VSEL Signal 3 0 HRESET 1 HRESET L2 Bus Input Threshold is Relative to: 1.8 V 2.5 V 2.5 V Not Supported Note 1 1, 2 1, 4, 5 --
Notes: 1. Caution: The input threshold selection must agree with the OVdd/L2OVdd voltages supplied. 2. To select the 2.5-V threshold option, BVSEL and/or L2VSEL should be tied to HRESET so that the two signals change state together. This is the preferred method for selecting this mode of operation. 3. To overcome the internal pull-up resistance, a pull-down resistance less than 250 ohms should be used. 4. Default voltage setting if left unconnected (internal pulled-up). 5. Caution: The XPC7410RXnnnNE does not support the default OVdd setting of 3.3 V. The BVSEL input must be tie either low or to HRESET.
Table 3 provides the recommended operating conditions for the MPC7410 part numbers described herein.
Table 3. Recommended Operating Conditions
Characteristic Core supply voltage PLL supply voltage L2 DLL supply voltage Processor bus supply voltage BVSEL = 0 BVSEL = HRESET BVSEL = HRESET or BVSEL = 1 L2 bus supply voltage L2VSEL = 0 L2VSEL = HRESET or L2VSEL = 1 Input voltage Processor bus and JTAG Signals L2 Bus Die-junction temperature Symbol Vdd AVdd L2AVdd OVdd OVdd OVdd L2OVdd L2OVdd Recommended Value 1.5V 50mV 1.5V 50mV 1.5V 50mV 1.8V 100mV 2.5V 100mV Not Supported 1.8V 100mV 2.5V 100mV Unit V V V V V V V V
Vin Vin Tj
GND to OVdd GND to L2OVdd 0 to 105
V V C
Note: These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed.
MPC7410 RISC Microprocessor Hardware Specifications Addendum for the MPC7410xxnnnNE Series, Rev. 2.0 Freescale Semiconductor 3
Features
Table 7 provides the power consumption for the MPC7410 part at the frequencies described herein.
Table 7. Power Consumption for MPC7410
Processor (CPU) Frequency 400Mhz Full-On Mode Typical Maximum Doze Mode Maximum Nap Mode Maximum Sleep Mode Maximum 1.3 1.45 W 1, 2 1.35 1.5 W 1, 2 3.6 4.1 W 1, 2 2.92 6.6 3.29 7.43 W W 1, 3 1, 2, Processor (CPU) Frequency 450Mhz
Unit
Notes
Sleep Mode--PLL and DLL Disabled Typical Maximum 0.6 1.1 0.6 1.1 W W 1, 3 1, 2
Notes: 1. These values apply for all valid processor bus and L2 bus ratios. The values do not include I/O Supply Power (OVdd and L2OVdd) or PLL/DLL supply power (AVdd and L2AVdd). OVdd and L2OVdd power is system dependent, but is typically <10% of Vdd power. Worst case power consumption for AVdd = 15 mw and L2AVdd = 15 mW. 2. Maximum power is measured at 105 C and Vdd = 1.5V while running an entirely cache-resident, contrived sequence of instructions which keep the execution units, including AltiVec, maximally busy. 3. Typical power is an average value measured at 65 C and Vdd = 1.5V in a system while running typical benchmarks.
MPC7410 RISC Microprocessor Hardware Specifications Addendum for the MPC7410xxnnnNE Series, Rev. 2.0 4 Freescale Semiconductor
Document Revision History
9 Document Revision History
Table 16 provides a revision history for this Hardware Specification Addendum.
Table 16. Document Revision History
Revision 2.0 Date 11/16/2007 Substantive Changes Updated document title to remove "RX" from part number since other non-RX package devices were added to this specification. Added MPC7410HX400NE, MPC7410VS400NE, MC7410VU400NE, MPC7410HX450NE, MPC7410VS450NE, and MC7410VU450NE devices to list on cover page and to Table A. Updated Table 17 to match corresponding table in MPC7410 Hardware Specifications Document template update Document ID change from MPC7410RXNEPNS for Part Number Specification to MPC7410ECS02AD for Hardware Specification Addendum. 1 10/2002 Minor formatting. Added Section 1.9 Document Revision History. Section 1.10.1 - added Table 17 - Part Marking Nomenclature. 0 Initial release
1.1
04/19/2005
MPC7410 RISC Microprocessor Hardware Specifications Addendum for the MPC7410xxnnnNE Series, Rev. 2.0 Freescale Semiconductor 5
Ordering Information
10 Ordering Information
10.1 Part Numbers Addressed by this Specification
Table 17 provides the ordering information for the MPC7410 part described in this document.
Table 17. Part Marking Nomenclature.
Mxx
Product Code MPC
7410
Part Identifier 7410
xx
Package RX = CBGA
nnn
Processor Frequency 1 400 450 500 400 450
N
Application Modifier N: 1.5 V 50 mV 0 to 105 C
E
Revision Level E: 1.4; PVR = 800C 1104
HX = HCTE_CBGA VS = HCTE_LGA MC VU = HCTE_CBGA (Lead Free C5 Solder Spheres)
Notes: 1. Processor core frequencies supported by parts are addressed by this specification only. Parts addressed by other specifications may support other maximum core frequencies.
10.3 Part Marking
Parts are marked as the example shown in Figure 26.
MPC7410 RXnnnNE MMMMMM ATWLYYWWA
7410 Notes: BGA nnn is the speed grade of the part MMMMMM is the 6-digit mask number ATWLYYWWA is the traceability code CCCCC is the country of assembly (this space is left blank if parts are assembled in the United States)
Figure 26. Freescale Part Marking for BGA Device
MPC7410 RISC Microprocessor Hardware Specifications Addendum for the MPC7410xxnnnNE Series, Rev. 2.0 6 Freescale Semiconductor
Ordering Information
THIS PAGE INTENTIONALLY LEFT BLANK
MPC7410 RISC Microprocessor Hardware Specifications Addendum for the MPC7410xxnnnNE Series, Rev. 2.0 Freescale Semiconductor 7
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Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. The Power Architecture and Power.org word marks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org.
(c) Freescale Semiconductor, Inc., 2002, 2007. Printed in the United States of America. All rights reserved.
Document Number: MPC7410ECS02AD Rev. 2.0 11/2007


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